Electronic component surface-mountable on circuit board

ABSTRACT

One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/844,386, filed Apr. 9, 2020, now U.S. Pat. No. 10,804,016, which is acontinuation of U.S. application Ser. No. 16/523,561, filed Jul. 26,2019, now U.S. Pat. No. 10,658,098, which is a continuation of U.S.application Ser. No. 16/117,458, filed on Aug. 30, 2018, now U.S. Pat.No. 10,418,162, which is a continuation of U.S. application Ser. No.15/704,409, filed on Sep. 14, 2017, now U.S. Pat. No. 10,090,089, whichis based on and claims the benefit of priority from Japanese PatentApplication Serial No. 2016-194284 (filed on Sep. 30, 2016), thecontents of each of which is hereby incorporated by reference in theirentireties.

TECHNICAL FIELD

The present disclosure is related to an electronic componentsurface-mountable on a circuit board. More specifically, the presentdisclosure is related to an electronic component soldered to a circuitboard.

BACKGROUND

In general, an electronic component surface-mountable on a circuit boardincludes an insulating base member, a circuit element (an inductor,capacitor, etc.) embedded in the base member, and external electrodeselectrically connected to the circuit element. In most cases, anelectronic component is joined to a circuit board by soldering. In orderto solder an electronic component to a circuit board, a gap (herein alsoreferred to as “standoff”) for filling solder is required between theelectronic component and the circuit board.

Some conventional electronic components are configured such that themounting surface of the base member and the external electrodes areflush with each other. In particular, electronic components manufacturedby photolithography are configured such that the mounting surface of thebase member and the external electrodes are flush with each otherbecause of its manufacturing method. Conventional electronic componentsmanufactured by photolithography are disclosed in Japanese PatentApplication Publication No. 2006-324489 (“the '489 Publication”). Theelectronic component shown in FIG. 1 of the '489 Publication includes aninsulating resin 104 and an external electrode 100 that are flush witheach other.

When the mounting surface of the base member and the external electrodeare flush with each other, a gap (standoff) for filling solder cannot bemaintained between the electronic component and the circuit board. Inaddition, when the mounting surface of the base member and the externalelectrodes are flush with each other, it is difficult to remove theoxide film formed on the external electrodes during inspection using acontact probe, and as a result, the contact resistance of the contactprobe is increased and inhibits accurate inspection.

SUMMARY

Accordingly, one object of the present disclosure is to provide anelectronic component in which a standoff for filling solder ismaintained. Another object of the present disclosure is to facilitateremoval of the oxide film formed on the external electrodes of theelectronic component during inspection using a contact probe. Otherobjects of the present invention will be apparent with reference to theentire description in this specification.

The electronic component according to an embodiment of the presentinvention is configured to be surface-mountable on a circuit board. Theelectronic component comprises: an insulating base member; an internalconductor provided in the base member; a first external electrodeprovided on the mounting surface of the base member so as to beelectrically connected to the internal conductor; and a second externalelectrode provided on the mounting surface of the base member so as tobe electrically connected to the internal conductor. In an embodiment ofthe present invention, the base member includes a pair of principalsurfaces opposed to each other, a pair of end surfaces opposed to eachother, and a pair of side surfaces opposed to each other. The outersurface of the base member is defined by the pair of principal surfaces,the pair of end surfaces, and the pair of side surfaces. Of the pair ofprincipal surfaces of the base member, the surface that faces thecircuit board when the electronic component is mounted may be hereinreferred to as “the mounting surface” of the base member. Further, thepair of principal surfaces may be referred to as the mounting surfaceand the top surface for discrimination. The pair of end surfaces includea first end surface and a second end surface. The pair of side surfacesinclude a first side surface and a second side surface.

In an embodiment of the present invention, the first external electrodeincludes a first electrode portion and a second electrode portion, thefirst electrode portion being flush with the mounting surface of thebase member, the second electrode portion being provided on the firstend surface of the base member. In an embodiment of the presentinvention, the second external electrode includes a third electrodeportion and a fourth electrode portion, the third electrode portionbeing flush with the mounting surface of the base member, the fourthelectrode portion being provided on the second end surface of the basemember.

In an embodiment of the present invention, the first external electrodehas a first protrusion, and the second external electrode has a secondprotrusion. The first protrusion and the second protrusion enables astandoff for filling solder to be maintained within a region defined bythe first external electrode, the second external electrode, themounting surface of the base member, and the circuit board. Further,when inspecting the electrical characteristics of the electroniccomponent using a contact probe, a larger pressure acts on theelectronic component from the contact probe at the positions of thefirst protrusion and the second protrusion. With this pressure, theoxide film formed on the first external electrode and the secondexternal electrode can be pushed away, so that the increase in thecontact resistance value of the contact probe can be suppressed and theinspection can be performed accurately.

In an embodiment of the present invention, the first protrusion isformed at an end portion of the first external electrode on the firstend surface side, and the second protrusion is formed at an end portionof the second external electrode on the second end surface side. Thus, alarger standoff can be maintained between the mounting surface of thebase member and the circuit board.

In an embodiment of the present invention, each of the first and secondprotrusions has a height from the mounting surface of the base memberequal to or greater than 5 μm. When a thin film (e.g., a Ni platinglayer or a Sn plating layer) is formed on the surfaces of the firstexternal electrode and the second external electrode, the height of thefirst protrusion and the height of the second protrusion do not includethe height of the thin film. For example, when a Sn plating layer isformed on the surfaces of the first external electrode and the secondexternal electrode, each of the first protrusion and the secondprotrusion not including the Sn plating layer has a height from themounting surface of the base member equal to or greater than 5 μm. In anembodiment of the present invention, each of the first and secondprotrusions has a height from the mounting surface of the base memberequal to or smaller than 50 μm.

In an embodiment of the present invention, the base member is formedsuch that the distance between the first end surface and the second endsurface is larger than the distance between the first side surface andthe second side surface and the distance between the first side surfaceand the second side surface is larger than the distance between the topsurface and the mounting surface. Thus, even a low profile electroniccomponent can have a standoff for filling solder maintained within aregion defined by the first electrode portion of the first externalelectrode, the third electrode portion of the second external electrode,the mounting surface of the base member, and the circuit board.

In an embodiment of the present invention, the base member is formedsuch that the distance between the first end surface and the second endsurface is larger than the distance between the first side surface andthe second side surface and the distance between the top surface and themounting surface is larger than the distance between the first sidesurface and the second side surface. Thus, even a high profileelectronic component can have a standoff for filling solder maintainedwithin a region defined by the first electrode portion of the firstexternal electrode, the third electrode portion of the second externalelectrode, the mounting surface of the base member, and the circuitboard.

In an embodiment of the present invention, the base member contains aninsulating resin and a filler. According to this embodiment, use of afiller having a lower density than the resin reduces the weight of theelectronic component.

In an embodiment of the present invention, the insulating resin is atransparent resin. According to this embodiment, an internal conductorprovided in the resin can be viewed, and therefore, it is possible toconfirm that the direction of the electronic component is correct whenit is mounted.

In an embodiment of the present invention, each of the surface layers ofthe first and second external electrodes comprises a Sn layer. Thus, thesolder wettability of the first external electrode and the secondexternal electrode can be increased. The Sn layer is provided on each ofthe first external electrode and the second external electrode via a Nilayer.

ADVANTAGES

One object of the present disclosure is to provide an electroniccomponent in which a standoff for filling solder is maintained. Anotherobject of the present disclosure is to facilitate removal of the oxidefilm formed on the external electrodes of the electronic componentduring inspection using a contact probe. In an electronic component inwhich the mounting surface of the base member and the externalelectrodes are flush with each other, a standoff for filling solder canbe maintained.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view of an electronic componentaccording to an embodiment of the present invention.

FIG. 2 is a schematic side view of the electronic component of FIG. 1 .

FIG. 3 is a schematic top view of the electronic component of FIG. 1 .

FIG. 4 is an enlarged sectional view showing the portion around themounting surface of the electronic component of FIG. 1 .

FIG. 5 is a perspective view of the electronic component of FIG. 1 asviewed from the mounting surface side.

FIG. 6 is a schematic side view of the inverted electronic component.

FIGS. 7A to 7F are schematic top views of electrode layers constitutingthe electronic component of FIG. 1 .

FIG. 8A is a schematic view showing a chip forming process for obtainingthe electronic component of FIG. 1 from a wafer.

FIG. 8B is a schematic view showing a chip forming process for obtainingthe electronic component of FIG. 1 from a wafer.

FIG. 8C is a schematic view showing a chip forming process for obtainingthe electronic component of FIG. 1 from a wafer.

FIG. 8D is a schematic view showing a chip forming process for obtainingthe electronic component of FIG. 1 from a wafer.

DESCRIPTION OF EXAMPLE EMBODIMENTS

Various embodiments of the invention will be described hereinafter withreference to the drawings. Elements common to a plurality of drawingsare denoted by the same reference signs throughout said plurality ofdrawings. It should be noted that the drawings do not necessarily appearin accurate scales, for convenience of description.

FIG. 1 is a schematic perspective view of an electronic componentaccording to an embodiment of the present invention, FIG. 2 is aschematic side view of the electronic component, and FIG. 3 is aschematic top view of the electronic component. These drawings show asurface-mountable coil element as an example of an electronic component.This coil element may be used for, e.g., eliminating noise in anelectronic circuit. This coil element may be either a power inductor tobe incorporated in a power supply line or an inductor used in a signalline. Further, electronic components to which the present invention isapplicable are not limited to coil elements. The present invention isapplicable to, e.g., capacitor elements, resistance elements, multilayerwiring boards, and various other electronic components, in addition tocoil elements.

An electronic component 100 may include a base member 10, an internalconductor 20, and an external electrode 30. In this specification, the“width” direction, the “length” direction, and the “thickness” directionof the electronic component 100 correspond to the “X” direction, the “Ydirection” and the “Z” direction in FIG. 1 , respectively, unlessotherwise understood in accordance with the context.

The base member 10 may have a first principal surface 101, a secondprincipal surface 102, a first end surface 103, a second end surface104, a first side surface 105, and a second side surface 106. The outersurface of the base member 10 may be defined by these six surfaces.Since the second principal surface 102 faces the circuit board (notshown), it may also be referred to as “a mounting surface” in thisspecification.

In one embodiment of the present invention, the base member 10 may havea substantially rectangular parallelepiped shape. The base member 10 mayhave a rectangular parallelepiped shape with a width direction in the Xaxis direction, a length direction in the Y axis direction, and a heightdirection in the Z axis direction. The base member 10 may have a width(the dimension in the X direction) of 0.05 to 0.3 mm, a length (thedimension in the Y direction) of 0.1 to 0.6 mm, and a height (thedimension in the Z direction) of 0.05 to 0.5 mm.

In an embodiment of the present invention, the base member 10 may beformed such that the length thereof is larger than the width thereof andthe width thereof is larger than the height thereof. In this case, theelectronic component 100 may have a low profile. In an embodiment of thepresent invention, the base member 10 may be formed such that the heightthereof is larger than the length thereof and the length thereof islarger than the width thereof. In this case, the electronic component100 may have a high profile.

The base member 10 may include an insulator body 11 and an top surfacelayer 12. The internal conductor 20 may be embedded in the insulatorbody 11. In an embodiment of the present invention, the top surfacelayer 12 may be constituted by a printing layer having characters ornumbers (e.g., a model number of the electronic component 100) printedthereon.

In an embodiment of the present invention, the insulator body 11 may bemade of a resin in which a multitude of filler particles are dispersed.In another embodiment of the present invention, the insulator body 11may be made of a resin including no filler particles. In an embodimentof the present invention, the resin contained in the insulator body 11may be a thermosetting resin having excellent insulation properties.

In an embodiment of the present invention, the top surface layer 12 maybe made of a resin in which a multitude of filler particles aredispersed, as may be the insulator body 11. It may also be possible thatthe top surface layer 12 is made of a resin film.

Examples of thermosetting resins used for the insulator body 11 includebenzocyclobutene (BCB), epoxy resin, phenol resin, unsaturated polyesterresin, vinyl ester resin, polyimide resin (PI), polyphenylene etheroxide resin (PPO), Bismaleimide triazine cyanate ester resin, fumarateresin, polybutadiene resin, polyvinylbenzyl ether resin.

It may also be possible that the resin material used as the material ofthe insulator body 11 is any of various transparent resins. Use of atransparent resin as the material of the insulator body 11 may enablevisual recognition of the internal conductor 20 from the outside of theelectronic component 100. Thus, it is possible to visually confirm thatthe direction of the electronic component 100 is correct when it ismounted.

In an embodiment of the present invention, the filler particles used forthe insulator body 11 may be, e.g., particles of a ferrite material,metal magnetic particles, particles of an inorganic material such asSiO₂ or Al₂O₃, or glass-based particles. Particles of a ferrite materialused for the insulator body 11 may be, for example, particles of Ni—Znferrite or particles of Ni—Zn—Cu ferrite. Metal magnetic particles usedfor the insulator body 11 may be made of a material in which magnetismis developed in an unoxidized metal portion, and may be, for example,particles including unoxidized metal particles or alloy particles. Metalmagnetic particles applicable to the present invention may includeparticles of, for example, Fe, an Fe—Si—Cr, Fe—Si—Al, or Fe—Ni alloy, anFe—Si—Cr—B—C or Fe—Si—B—Cr amorphous alloy, or a material obtained bymixing them. Pressurized powder bodies obtained from these types ofparticles can also be used as the metal magnetic particles for theinsulator body 11. Moreover, these types of particles or pressurizedpowder bodies obtained therefrom each having a surface thermally treatedto form an oxidized film thereon can also be used as the metal magneticparticles for the insulating body 11. The metal magnetic particles forthe insulator body 11 can be manufactured by, for example, an atomizingmethod. Furthermore, it may also be possible that metal magneticparticles for the insulator body 11 are manufactured by a known methodother than atomizing methods. Furthermore, commercially available metalmagnetic particles can also be used for the insulator body 11. Examplesof commercially available metal magnetic particles may include PF-20Fmanufactured by Epson Atmix Corporation and SFR-FeSiAl manufactured byNippon Atomized Metal Powders Corporation.

The filler particles used for the insulator body 11 may be made of amaterial having a lower density than the resin used for the insulatorbody 11. Thus, the weight of the electronic component 100 can bereduced.

The internal conductor 20 may be provided inside the base member 10. Inan embodiment of the present invention,

the internal conductor 20 may include a plurality of pillared conductivemembers 21 and a plurality of connecting conductive members 22. Theplurality of pillared conductive members 21 and the plurality ofconnecting conductive members 22 may constitute a coil portion 20L.

The plurality of pillared conductive members 21 may be each formed in asubstantially columnar shape with a central axis thereof arranged inparallel with the Z-axis direction. In an embodiment of the presentinvention, the plurality of pillared conductive members 21 may have acircular, elliptic, or oval cross section cut along the directionperpendicular to the central axis. When the plurality of pillaredconductive members 21 have an elliptic or oval cross section cut alongthe direction perpendicular to the central axis, the ratio of the majoraxis to the minor axis may be not greater than 3. The plurality ofpillared conductive members 21 may be divided into two groups separatedfrom each other in the substantially Y-axis direction. One of thesegroups may include a plurality of first pillared conductive members 211.The plurality of first pillared conductive members 211 may be arrangedin the X-axis direction at intervals. The other group may include aplurality of second pillared conductive members 212. The plurality ofsecond pillared conductive members 212 may also be arranged in theX-axis direction at intervals.

The first pillared conductive members 211 and the second pillaredconductive members 212 may be configured to have about the same diameterand about the same height. In the illustrated example, the group of thefirst pillared conductive members 211 and the group of the secondpillared conductive members 212 may include five members each. As willbe described later, the first and second pillared conductive members211, 212 may be formed by stacking more than one via conductive membersin the Z-axis direction. The reason why the pillared conductive membershave substantially the same radius is to prevent increase of resistance,and this may be achieved when variation in the dimension of the pillaredconductive members as viewed in the same direction is reduced to 10% orsmaller. The reason why the pillared conductive members havesubstantially the same height is to secure stacking accuracy of thelayers, and this may be achieved when a difference in the height of thepillared conductive members is reduced to, for example, 10 μm orsmaller.

The plurality of connecting conductive members 22 may be divided intotwo groups that are formed in parallel with the XY plane and opposed toeach other in the Z-axis direction. One of these groups may include aplurality of first connecting conductive members 221, and the other mayinclude a plurality of second connecting conductive members 222. In theillustrated example, the group of the first connecting conductivemembers 221 may include five connecting conductive members and the groupof the second connecting conductive members 222 may include fourconnecting conductive members.

The plurality of first connecting conductive members 221 may be arrangedbetween the first pillared conductive members 211 and the secondpillared conductive members 212. The plurality of first connectingconductive members 221 may extend along the Y-axis direction and may bearranged in the X-axis direction at intervals. The plurality of secondconnecting conductive members 222 may be arranged between the firstpillared conductive members 211 and the second pillared conductivemembers 212. The plurality of second connecting conductive members 222may extend at an angle with respect to the Y-axis direction and may bearranged in the X-axis direction at intervals.

The first connecting conductive members 221 are each connected withupper ends of a pair of pillared conductive members 211, 212, and thesecond connecting conductive members 222 are each connected with lowerends of a pair of pillared conductive members 211, 212. The first andsecond pillared conductive members 211, 212 and the first and secondconnecting conductive members 221, 222 may be connected to each other soas to form a rectangular helix in the X-axis direction. Thus, providedin the inside of the base member 10 is the coil portion 20L that has thecentral axis (a coil axis) extending in the X-axis direction and has arectangular opening.

The internal conductor 20 may further include an extended portion 23 anda comb-tooth block portion 24 that connect between the coil portion 20Land the external electrode 30 (31, 32).

The internal conductor 20 may be formed of a metal material havingexcellent conductivity such as Cu (copper), Al (aluminum), Ni (nickel),or Ag (silver).

The extended portion 23 may include a first extended portion 231 and asecond extended portion 232. The first extended portion 231 may becoupled to a lower end of the first pillared conductive member 211 thatforms one end of the coil portion 20L, and the second extended portion232 may be coupled to a lower end of the second pillared conductivemember 212 that forms the other end of the coil portion 20L. The firstand second extended portions 231, 232 may be provided in the same XYplane as the second connecting conductive members 222 and may bearranged in parallel with the Y-axis direction.

The comb-tooth block portion 24 may include a first comb-tooth blockportion 241 and a second comb-tooth block portion 242. The firstcomb-tooth block portion 241 and the second comb-tooth block portion 242may be separated from each other in the Y-axis direction. Each of thefirst comb-tooth block portion 241 and the second comb-tooth blockportion 242 may have a plurality of teeth. As shown in FIG. 1 , thefirst and second comb-tooth block portions 241 and 242 are configuredsuch that the distal ends of the teeth thereof face in the upwarddirection in FIG. 1 . A part of the first and second comb-tooth blocks241, 242 may be exposed on the end surfaces 103, 104 and the mountingsurface 102 of the base member 10. Each tooth of the first comb-toothblock portion 241 may be electrically connected to adjacent teeth at aportion near the lower end thereof or at other portions, and similarly,each tooth of the second comb-tooth block portion 242 may beelectrically connected to adjacent teeth at a portion near the lower endthereof or at other portions.

The first and second extended portions 231, 232 may be coupled to aspace between predetermined two adjacent teeth of the first and secondcomb-tooth block portions 241, 242, respectively (see FIG. 3 ).

At the bottom of the first and second comb-tooth block portions 241,242, there may be provided conductor layers 301, 302 that constituteunderlayers of the external electrode 30 (see FIG. 2 ). The conductorlayers 301, 302 may be formed of a metal material such as Cu (copper),Al (aluminum), Ni (nickel), or Ag (silver).

Both the conductor layer 301 and the conductor layer 302 may have a flatshape. A protruding portion 301 a may be formed on the end portion ofthe conductor layer 301 on the first end surface 103 side, and aprotruding portion 302 a may be formed on the end portion of theconductor layer 302 on the second end surface 104 side. As will bedescribed later, the protruding portion 301 a and the protruding portion302 a may be formed by a blade of a dicing saw in the process ofdividing the electronic component from the wafer. In an embodiment ofthe present invention, the protruding portion 301 a may be formed so asto curve toward the inner side of the electronic component 100 (that is,toward the protruding portion 302 a). Likewise, the protruding portion302 a may be formed so as to curve toward the inner side of theelectronic component 100 (that is, toward the protruding portion 301 a).

On the surfaces of the conductor layer 301 and the conductor layer 302,there may be formed the external electrode 30. The external electrode 30may serve as an external terminal for surface mounting. The externalelectrode 30 may include a first external electrode 31 and a secondexternal electrode 32. The first external electrode 31 and the secondexternal electrode 32 may be separated from each other in the Y-axisdirection. The first external electrode 31 and the second externalelectrode 32 may be formed in the mounting surface 102 of the basemember 10. The first external electrode 31 may extend onto the endsurface 103, in addition to the mounting surface 102 of the base member10. The second external electrode 32 may extend onto the end surface104, in addition to the mounting surface 102 of the base member 10.

In an embodiment of the present invention, the first and second externalelectrodes 31, 32 may each include first electrode portions 30A thatcover opposite end portions of the mounting surface 102 of the basemember 10 in the Y-axis direction, and second electrode portions 30Bthat cover the end surfaces 103, 104 of the base member 10 over apredetermined height, as illustrated in FIG. 2 . The first electrodeportions 30A may be electrically connected to the bottoms of the firstand second comb-tooth block portions 241, 242 through the conductorlayers 301, 302, respectively. The second electrode portions 30B may beformed on the end surfaces 103, 104 of the base member 10 so as to coverthe side portions of the first and second comb-tooth block portions 241,242. When the side portions of the first and second comb-tooth blockportions 241, 242 are exposed on the first end face 103 and the secondend face 104, the second electrode portions 30B may be electricallyconnected to the side portions of the first and second comb-tooth blockportions 241, 242.

In an embodiment of the present invention, a protrusion 305 may beformed at the end portion of the first external electrode 31 on thefirst end face 103 side, and a protrusion 306 may be formed at the endportion of the second external electrode 32 on the second end face 104side. In an embodiment of the present invention, the protrusion 305 maybe formed at a position corresponding to the protruding portion 301 a ofthe conductor layer 301 in the Y direction. The protrusion 306 may beformed at a position corresponding to the protruding portion 302 a ofthe conductor layer 302 in the Y direction.

In an embodiment of the present invention, the first external electrode31 and the second external electrode 32 may be constituted by two platedlayers. For example, the two plating layers may include, for example, afirst plating layer that covers the conductor layer 301, the conductorlayer 302, and both end faces 103, 104 of the base member 10 over apredetermined height and a second plating layer formed so as to coverthe first plating layer. The first plating layer may be formed so as tocover the entire lower surfaces of the conductor layer 301 and theconductor layer 302 in order to protect the conductor layer 301 and theconductor layer 302. In an embodiment of the present invention, thefirst plating layer may be a nickel plating layer containing nickel(Ni). In an embodiment of the present invention, the second platinglayer may be a tin plating layer containing tin (Sn).

In an embodiment of the present invention, the first external electrode31 and the second external electrode 32 may be made of paste of anelectrically conductive material. One example of the electricallyconductive material may be Ag paste.

With reference to FIG. 4 and FIG. 5 , the first external electrode 31and the second external electrode 32 of the electronic component 100according to the embodiment of the present invention will be furtherdescribed. FIG. 4 is an enlarged cross-sectional view of the vicinity ofthe mounting surface of the electronic component 100, and FIG. 5 is aperspective view of the electronic component 100 as viewed from themounting surface side.

As shown, the first electrode portions 30A of the first externalelectrode 31 and the second external electrode 32 may include flatsurfaces 30A1 and curved surfaces 30A2. The curved surfaces 30A2 may beconnected to end portions of the flat surfaces 30A1 on the end surfaces103, 104 side and may be constituted by curved surfaces. In anembodiment of the present invention, the flat surfaces 30A1 of the firstexternal electrode 31 and the second external electrode 32 may be flushwith the bottom surface 102 of the insulator body 11. The curved surface30A2 of the first external electrode 31 may define the outer surface ofthe protrusion 305, and the curved surface 30A2 of the second externalelectrode 32 may define the outer surface of the protrusion 306.

In an embodiment of the present invention, The protrusion 305 may have aheight H2 from the lower surface of the conductor layer 301 (that is, aheight from the mounting surface 102 of the electronic component 100)ranging from 5 μm to 50 μm, from 6 μm to 30 μm, or from 7 μm to 15 μm.To achieve such a height of the protrusion 305, the protruding portion301 a of the conductor layer 301 may have a height H1 from the lowersurface of the conductor layer 301 ranging from 1 μm to 45 μm, from 2 μmto 25 μm, or from 3 μm to 10 μm.

In an embodiment of the present invention, the protrusion 305 may beformed such that the length L2 thereof in the length direction of theelectronic component 100 (Y direction) is 1/100 to 1/10 of the length L1of the electronic component 100.

The protrusion 306 may have the same dimensions as the protrusion 305.

Thus, the protrusion 305 may be formed on the surface of the externalelectrode 31 and the protrusion 306 may be formed on the surface of theexternal electrode 32, and therefore, a standoff S may be formed betweenthe mounting surface 102 of the electronic component 100 and themounting board 200. This standoff S may be defined by the mountingsurface 102 of the electronic component 100, the surface of the mountingboard 200, and the flat surfaces 30A1 and the curved surfaces 30A2 ofthe first external electrode 31 and the second external electrode 32.When the electronic component 100 is soldered to the mounting board 200,the standoff S may be filled with solder.

Further, when inspecting the electrical characteristics of theelectronic component using a contact probe (not shown), a largerpressure may act on the electronic component 100 from the contact probeat the positions of the protrusion 305 and the protrusion 306. With thispressure, the oxide film formed on the first external electrode 31 andthe second external electrode 32 can be pushed away, so that theincrease in the contact resistance value of the contact probe may besuppressed and the inspection can be performed accurately.

Next, the lamination structure of the electronic component 100 will bedescribed with reference to FIG. 6 and FIG. 7 . FIG. 6 is a schematicside view of the inverted electronic component 100; and FIGS. 7A to 7Fare schematic top views of a film layer L1 and electrode layers L2-L6 ofFIG. 6 . The external electrode 30 is omitted in FIG. 6 and FIG. 7 .

Referring to FIG. 6 , the electronic component 100 may be laminated witha film layer L1 and electrode layers L2-L6. The electrode layers L2-L6may be stacked in the height direction with bonding surfaces S1-S4 (seeFIG. 6 ) interposed therebetween. The film layer L1 and the electrodelayers L2-L6 may include elements of the base member 10 and the internalconductor 20. The laminate including the film layer L1 and the pluralityof electrode layers L2-L6 stacked together may be manufactured by abuild-up method. In the embodiment, the film layer L1 and the electrodelayers L2-L6 may be stacked sequentially in the Z-axis direction fromthe top surface 101 to the mounting surface 102. Conversely, it may alsobe possible that the film layer L1 and the electrode layers L2-L6 may besequentially stacked from the mounting surface 102 to the top surface101. The number of the layers is not particularly limited, and it may besix in this example. The laminate including the film layer L1 and theelectrode layers L2-L6 stacked together is manufactured not in the unitof an element (the unit of a component) but in the unit of a waferincluding a large number of elements (components). FIG. 6 shows only aregion corresponding to one element among the laminates manufactured inthe unit of a wafer.

The film layer L1 may be constituted by the top surface layer 12 thatprovides the top surface 101 of the base member 10 (FIG. 7A). Theelectrode layer L2 may include an insulating layer 110 (112) that formsa part of the base member 10 (the insulator body 11), and the firstconnecting conductive members 211 (FIG. 7B). The electrode layer L3 mayinclude the insulating layer 110 (113), and via conductive members V1that form a part of the pillared conductive members 211, 212 (FIG. 7C).The electrode layer L4 may include the insulating layer 110 (114), thevia conductive members V1, and via conductive members V2 that form apart of the comb-tooth block portions 241, 242 (FIG. 7D). The electrodelayer L5 may include the insulating layer 110 (115), the via conductivemembers V1, V2, the extended portions 231, 232, and the secondconnecting conductive members 222 (FIG. 7E). The electrode layer L6 mayinclude the insulating layer 110 (116) and the via conductive members V2(FIG. 7F).

Next, a manufacturing process of the electronic component 100 will bedescribed with reference to FIGS. 8A to 8D. First, as shown in FIG. 8A,a wafer W having the lamination structure shown in FIG. 6 ismanufactured by, e.g., the build-up method described above.

Next, the wafer W may be cut into the size of a unit component. Thecutting of the wafer W may be performed using, for example, a blade DBof a dicing saw. Each of the electrode layers L2-L6 of the wafer W isformed such that the interval W2 between the conductor layer 301 of oneunit component and the conductor layer 302 of another unit componentadjacent to the one unit component in the length direction may beslightly smaller than the width W1 of the blade DB of the dicing saw. Inan embodiment of the present invention, the interval W2 may be 0.1% to10% smaller than W1. In an embodiment of the present invention, theinterval W2 may be 0.5%, 1.0%, 1.5%, 2.0%, 2.5%, 3.0%, 3.5%, 4.0%, 4.5%,5.0%, 5.5%, 6.0%, 6.5%, 7.0%, 7.5%, 8.0%, 8.5%, 9.0%, 9.5%, 10.0%,20.0%, or 30.0% smaller than W1.

The blade DB, which moves farther or closer with respect to the plane ofpaper, may be inserted between the conductor layer 301 of one unitcomponent formed in the wafer W and the conductor layer 302 of anotherunit component adjacent to the one unit component in the lengthdirection. Thus, as shown in FIG. 8B, the wafer W may be divided intounit elements (divided into chips).

Since the wafer W is divided with the blade DB having a width W1, theblade DB may contact the side surfaces of the conductor layer 301 andthe conductor layer 302 during cutting of the wafer W. As a result, asshown in FIG. 8B, burrs 401 a and burrs 402 a may be formed at the endportions of the conductor layer 301 and the conductor layer 302,respectively, in the divided laminate 100A.

Next, the burrs 401 a and the burrs 402 a may be curved toward the innerside of the laminate 100A to form the protruding portion 301 a and theprotruding portion 302 a, respectively. The protruding portion 301 a andthe protruding portion 302 a thus formed may be curved toward eachother, as shown in FIG. 8C. The step of curving the burrs 401 a and theburrs 402 a may be performed by, e.g., barrel processing.

Next, as shown in FIG. 8D, the external electrode 31 and the externalelectrode 32 may be formed on the conductor layer 301 with theprotruding portion 301 a and the conductor layer 302 with the protrudingportion 302 a, respectively. The external electrode 31 and the externalelectrode 32 may be made of, for example, two plated layers including aNi plating layer and a Sn plating layer. Thus, the protrusion 305 may beformed at a position in the external electrode 31 corresponding to theprotruding portion 301 a, and the protrusion 306 may be formed at aposition in the external electrode 32 corresponding to the protrudingportion 302 a. In an embodiment of the present invention, the conductorlayer 301 and the protruding portion 301 a, and the conductor layer 302and the protruding portion 302 a may be continuously formed of the samematerial.

Thus, the wafer having a large number of electronic components(excluding the external electrodes 31, 32) formed therein may bedivided, and the external electrodes 31, 32 may be formed on the dividedlaminates to obtain the electronic components 100.

The dimensions, material, and arrangement of the elements describedherein are not limited to those explicitly described for theembodiments. The elements are susceptible of modifications for desireddimensions, materials, and arrangements within the scope of the presentinvention. The elements other than those explicitly described herein canbe added to the described embodiments; and part of the elementsdescribed for the embodiments can be omitted.

What is claimed is:
 1. A method of manufacturing an electroniccomponent, comprising: preparing a wafer, the wafer including: a firstunit internal conductor; a second unit internal conductor spaced at adistance from the first unit internal conductor; a first conductor layerprovided on the first unit internal conductor; a second conductor layerprovided on the second unit internal conductor; and a connectionconductor layer connecting between the first conductor layer and thesecond conductor layer; cutting the wafer at a position of theconnection conductor layer, so as to obtain a unit device including thefirst unit internal conductor and the first conductor layer; curving aburr formed on the first conductor layer, so as to form a protrudingportion; and forming an external electrode on the first conductor layerof the first unit internal conductor so as to cover the protrudingportion.
 2. The method according to claim 1, wherein the wafer is cutusing a blade having a blade width larger than the distance between thefirst unit internal conductor and the second unit internal conductor. 3.The method according to claim 2, wherein the burr is formed by the bladecontacting the first conductor layer.
 4. The method according to claim2, wherein the blade width is 0.1 to 10 percent larger than the distancebetween the first unit internal conductor and the second unit internalconductor.
 5. The method according to claim 2, wherein a burr is formedat an end portion of the second conductor layer by the blade contactingthe second conductor layer.
 6. The method according to claim 1, whereinthe burr is formed at an end portion of the first conductor layer. 7.The method according to claim 1, wherein the burr is curved toward thefirst unit internal conductor.
 8. The method according to claim 1,wherein the burr is curved by barrel processing.
 9. The method accordingto claim 1, wherein the first conductor layer, the second conductorlayer, and the connection conductor layer are recessed from a surface ofthe wafer toward an interior of the wafer.
 10. The method according toclaim 1, wherein the burr protrudes from a surface of the wafer.
 11. Amethod of manufacturing an electronic component surface-mountable on acircuit board by cutting a wafer, wherein the electronic componentincludes: an insulating base member having a mounting surface and firstand second end surfaces, the electronic component beingsurface-mountable on the circuit board such that the mounting surfacefaces the circuit board, the first and second end surfaces being opposedto each other and connected with each other via the mounting surface; aninternal conductor provided in the base member; a first externalelectrode provided on the mounting surface of the base member so as tobe electrically connected to the internal conductor; and a secondexternal electrode provided on the mounting surface of the base memberso as to be electrically connected to the internal conductor, whereinthe first external electrode has a first protrusion formed thereon, andthe second external electrode has a second protrusion formed thereon,wherein the first external electrode includes a first electrode portionand a second electrode portion, the first electrode portion being flushwith the mounting surface of the base member, the second electrodeportion being provided on the first end surface of the base member,wherein the second external electrode includes a third electrode portionand a fourth electrode portion, the third electrode portion being flushwith the mounting surface of the base member, the fourth electrodeportion being provided on the second end surface of the base member, andwherein the first protrusion is formed on the first electrode portion ofthe first external electrode, and the second protrusion is formed on thethird electrode portion of the second external electrode.